OUR PART # 50-21750
This environmentally safe solder is designed to replace the standard lead barring type of solder for electronic connections. The reflow temperature is 217-219° C. The alloy is 95.5% Tin (Sn)/4 % Silver (Ag)/0.5% Copper (Cu). This combination is the best for soldering electronic connections while retarding the dissolution of copper. It has excellent wetting and spreading properties. Philmore offers this solder with a No-Clean Flux.